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275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

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275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

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Brand Name :	PLINK
Model Number :	ORIN64-8F4E1
Price :	To be negotiated
Payment Terms :	T/T, D/P, D/A, L/C
Supply Ability :	Batch purchase price negotiation
Delivery Time :	15-30 work days

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275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

NVIDIA Jetson AGX Orin 64G Industrial Embedded Computer

The NVIDIA Jetson industrial embedded pc (ORIN64-8F4E1) is with NVIDIA Jetson AGX Orin core module and the AI-enabled NVIDIA RTX 6000/A6000 GPU. Each reference application utilizes the necessary I/O components and drivers to move data and feed it into the processing pipeline on the RTX 6000 /A6000 GPU, providing a functionally tested data path setup, and it is the high performance embedded computing with NVIDIA Jetson AGX Orin 64G Module, the AI performance of Jetson AGX Orin module is 275 TOPS,The HD Audio-Video Subsystem uses a collection of functional blocks to off-load audio and video processing activities fromthe CPU complex, resulting in fast, fully concurrent, highly efficient operation.

This subsystem is comprised of the following:

(2x) Multi-Standard Video Decoder
(2x) Multi-Standard Video Encoder
JPG Processing Block
Video Image Compositor (VIC)
Audio Processing Engine (APE)

The initial setting can be reset and restored

Maximum scalability 512g TF card memory

4G and WIFI module can be extended

Optional expansion	32GB ~ 1TB SSD storage
Processor	AGX Orin module
GPU	NVIDIA RTX 6000/A6000
Memory	64G
Weight	5500g
Power requirements	220V
Size	335mm257mm146mm
Working temperature	-20~+65℃

275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

NVIDIA Jetson Orin 64GB Technical Specifications

Power	15 W \| 30 W \| 50 W, and up to 60 W
CPU	12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
GPU	2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores
Vision and DNN accelerators	Up to 105 INT8 TOPS (Sparse, Deep Learning Inference)
Memory	64 GB LPDDR5
Storage	64 GB eMMC 5.1
AI Performance	275 TOPS
Display	1×: shared HDMI™ 2.1, eDP1.4, VESA® DisplayPort™ (DP) HBR3
Ethernet	1x GbE: RGMII 1× 10GbE: MGBE by XFI
PCIe	PCI Express 4.0 x1, x2, x4 and x8 Up to 2x Endpoint supported
USB	3x: USB 3.2 4x: USB 2.0
Other	UART, SPI, CAN, I2C, I2S, GPIOs
Module dimensions	100.0 mm × 87.0 mm × 16.0 mm
Temperature range (at Thermal Transfer Plate (TTP) surface)	-25 °C to 80 °C
Operating humidity	5% to 85% RH
Storage temperature	-25 °C to 80 °C
Storage humidity	30% to 70% RH

Note: See the NVIDIA Jetson AGX Orin Design Guide for details on the UPHY configurations supported. MGBE, USB 3.2, and PCIe share UPHY Lane.

NVIDIA Ampere GPU

Advanced GPU including CUDA cores, Ray-Tracing (RT) cores and 3rd Generation Tensor cores | Enhanced compute capability

2 GPC | 8 TPC | Up to 170 INT8 Sparse TOPS or 85 FP16 TFLOPS | Up to 5.32 FP32 TFLOPS or 10.649 FP16 TFLOPS (CUDA cores)

Arm Cortex-A78AE CPU

12× Arm Cortex-A78AE cores | 3 CPU clusters (4 cores/cluster) | 259 SPECint_rate2006

Arm® v8.2 (64-bit) | Symmetric multi-processing (SMP) | NEON SIMD | High-performance coherent interconnect fabric

Module Mechanical Drawing Side View

275 TOPS AI Medical Industrial IPC Embedded Computer NVIDIA Jetson AGX Orin

RTX 6000 /A6000 Specifications

	RTX 6000	RTX A6000
NVIDIA CUDA Cores	4608	10752
NVIDIA Tensor Cores	576	336
GPU Memory	24GB GDDR6	48GB GDDR6
Memory interface	384-bit
Memory Bandwidth	Up to 672 GB/s	Up to 768 GB/s
Max Power Consumption	295 W	300 W
NVIDIA NVLink bandwidth	100GB/s (bidirectional)	112.5GB/s (bidirectional)
Error-correcting code (ECC)	Yes

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